ESD Tapes
Copper Grounding Tape
Used extensively to pre place a thin conductive grid underlayment for ESD conductive or dissipative flooring materials. Excellent for grounding flooring to AC electrical conduit and building ground system. Engineered with a full length, liner covered adhesive backing designed for optimum bond strength to pre-cleaned substrates.
PHYSICAL PROPERTIES:
Backing thickness | 2Mil conductive copper foil |
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Adhesive thickness | 1.5Mil acrylic |
Total thickness | 3.5Mil |
Liner | Paper (yellow color) |
Adhesion to steel | 17.5 oz/in |
Tensile strength | 22 lb/in |
Elongation | 2% |
Insulation | UL approved |